The POLOS Spin Coater Spin150 wafer spinner system allows for thin film application onto a variety of surfaces or substates.
Spin coating generally involves the application of a thin film (a few nm to a few um) evenly across the surface of a substrate by coating (casting) a solution of the desired material in a solvent (an “ink”) while it is rotating, at ambient temperature. The rotation of the substrate at high speed (usually >10 rotations per second = 600 rpm) means that the centripetal force combined with the surface tension of the solution pulls the liquid coating into an even covering.
The Spin Coater is located within a fumehood with a vacuum pump.